Engineering Specs
Board Support & Manufacturing Constraints
Layer Support
Comprehensive support for single-sided, double-sided, and high-density multilayer boards (HDI) up to 24 layers. Expert handling of tight impedance control and buried/blind via configurations.
Assembly Components
Precision SMD placement down to 0201 packages. Advanced proficiency with BGA, QFN, CSP, and Package-on-Package (PoP) technologies. Integrated THT line for mixed-technology production.
Materials & Substrates
Broad handling capabilities including Standard FR4, High-Tg, Polyimide (Flexible PCB), Aluminum/Metal Core, and Rogers high-frequency substrates for RF engineering applications.
Inspection Standards
100% Automated Optical Inspection (AOI) as standard. X-Ray analysis for hidden solder joints on BGA/QFN. First Article Inspection (FAI) performed on every production run for total consistency.
Quality Assurance
Assembly Standards Dedicated to Absolute Device Reliability
OCD PCB delivers industry-leading assembly standards for high-reliability sectors. We specialize in precision SMD placement and critical THT hand-soldering, employing bespoke reflow profiles for every technical board configuration. Our hands-on workshop approach ensures every joint is verified for mechanical and electrical integrity.
Each assembly process integrates a robust Design for Manufacturing (DfM) review, addressing potential challenges in solder paste volume and thermal management. This proactive engineering support ensures your device transitions seamlessly from prototype to full production with consistent performance.
100% Verified Quality
We employ AOI Automated Optical Inspection and rigorous visual diagnostics to guarantee zero-defect delivery across all PCB assemblies.